• Ofhc Copper Backing Plate for Sputtering Target Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Bonding

Ofhc Copper Backing Plate for Sputtering Target Bonding

Type: Backing Plate
Shape: Square
Certification: TUV, ISO, CE
Materials: Copper
Purity: Over 99.95%
MOQ: 1PC
Customization:
Diamond Member Since 2018

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Manufacturer/Factory

Basic Info.

Model NO.
XK-Cu
Application
Sputtering Target Bonding
Free Sample
Available
Packing
Vacuum Packed
Certificate
COA, Coc
Delivery
10-20 Days
Transport
by Air, by Sea
Certificate of Origin
Available
Transport Package
Vacuum Sealed Inside
Specification
customize
HS Code
848690
Production Capacity
2000PCS/Month

Product Description

OFHC Copper Backing Plates

 

Features

Machined from oxygen-free, high-conductivity copper.

  • For regular, circular disc-type sputtering sources
  • Most sputter sources accept a 0.125" (1/8") thick target bonded to a 0.125" thick backing plate
  • For targets of other thicknesses, choose the backing plate thickness to adjust the total thickness to 0.250" (1/4") to suit most applications

Company Profile:

Since 2014

Specializing in high purity sputtering targets.

Leader manufacturer of sputtering materials in China.

Qualified the world certificates such as ISO9001:2008 and SGS.

Comprehensive in R&D, manufacturing, and sales on thin film materials.

Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.
Ofhc Copper Backing Plate for Sputtering Target BondingOfhc Copper Backing Plate for Sputtering Target Bonding

OUR PRODUCTS     

*Metal Target : W, Mo, Ta, Nb, Cu, V, Ni, Ti, Fe, Al ,Zr, Co, Au, Ag, Pt, etc.

*Alloy Target : NiFe, NiCr, NiV, CuNi,TiAl, CoCr, CoFe, WTi, CoTaZr,CuInGa, ZnSn, CuZn, etc

*Ceramic Target : TiO2,Al2O3,Ta2O5, ZrO2,SiC,SiO,SiO2, ITO, GZO, AZO, WS2, MoS2,Ga2O3,HfO2,etc

*Evaporation Materials : Crucible, Pellets,Granules,Pieces,etc

*Backing Plate: Cu, Mo, SS,etc

*Bonding Service: Indium, Elastomer 
 Ofhc Copper Backing Plate for Sputtering Target Bonding    
                                      
 OUR ADVANTAGE

1,Many years manufacturing & exporting experience.

2 Strict & complete QC systerm

3,Perfect after sale systerm                                                   
Ofhc Copper Backing Plate for Sputtering Target Bonding
 
PACKING & DELIVERY
 
Packaging Detail:
Inside: drying agent and vacuum sealed to prevent oxidization
Outside: wooden case to avoid damage during transportation

 
Delivery Detail: Within 3-15 working days .
DHL, FedEx, UPS door to door service, 5-7 days from China to your country.
 
Ofhc Copper Backing Plate for Sputtering Target Bonding
OUR CERTIFICATE
Ofhc Copper Backing Plate for Sputtering Target Bonding
Ofhc Copper Backing Plate for Sputtering Target Bonding


 

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Diamond Member Since 2018

Suppliers with verified business licenses

Manufacturer/Factory
Management System Certification
ISO 9001, ISO 14001