Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding

Product Details
Customization: Available
Type: Backing Plate
Shape: Round

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  • Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding
  • Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding
  • Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding
  • Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding
  • Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding
  • Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding
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Basic Info.

Model NO.
XK-Cu
Certification
TUV, ISO, CE
Materials
Copper
Purity
4n
MOQ
1PC
Application
Sputtering Target Bonding
Free Sample
Available
Packing
Vacuum Packed
Certificate
Coa, Coc
Delivery
10-20 Days
Transport
by Air, by Sea
Certificate of Origin
Available
Transport Package
Vacuum Sealed
Specification
customize
Trademark
no
Origin
China
HS Code
848690
Production Capacity
2000PCS/Month

Product Description

OFHC Copper Backing Plates

 

Features

Machined from oxygen-free, high-conductivity copper.

  • For regular, circular disc-type sputtering sources
  • Most sputter sources accept a 0.125" (1/8") thick target bonded to a 0.125" thick backing plate
  • For targets of other thicknesses, choose the backing plate thickness to adjust the total thickness to 0.250" (1/4") to suit most applicationsSputtering Target+Copper Backing Plate for Indium/Elastomer BondingSputtering Target+Copper Backing Plate for Indium/Elastomer Bonding

Company Profile:

Since 2014

Specializing in high purity sputtering targets.

Leader manufacturer of sputtering materials in China.

Qualified the world certificates such as ISO9001:2008 and SGS.

Comprehensive in R&D, manufacturing, and sales on thin film materials.

Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.
Sputtering Target+Copper Backing Plate for Indium/Elastomer BondingSputtering Target+Copper Backing Plate for Indium/Elastomer Bonding

OUR PRODUCTS     

*Metal Target : W, Mo, Ta, Nb, Cu, V, Ni, Ti, Fe, Al ,Zr, Co, Au, Ag, Pt, etc.

*Alloy Target : NiFe, NiCr, NiV, CuNi,TiAl, CoCr, CoFe, WTi, CoTaZr,CuInGa, ZnSn, CuZn, etc

*Ceramic Target : TiO2,Al2O3,Ta2O5, ZrO2,SiC,SiO,SiO2, ITO, GZO, AZO, WS2, MoS2,Ga2O3,HfO2,etc

*Evaporation Materials : Crucible, Pellets,Granules,Pieces,etc

*Backing Plate: Cu, Mo, SS,etc

*Bonding Service: Indium, Elastomer 
     
   Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding                                   
 OUR ADVANTAGE

1,Many years manufacturing & exporting experience.

2 Strict & complete QC systerm

3,Perfect after sale systerm                                                   

 Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding
PACKING & DELIVERY
 
Packaging Detail:
Inside: drying agent and vacuum sealed to prevent oxidization
Outside: wooden case to avoid damage during transportation

 
Delivery Detail: Within 3-15 working days .
DHL, FedEx, UPS door to door service, 5-7 days from China to your country.
 
Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding
OUR CERTIFICATE
Sputtering Target+Copper Backing Plate for Indium/Elastomer Bonding



 

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