High-Purity Aluminum Nitride Sputter Coating Target

• Type: Ceramic Target
• Shape: Round
• Certification: TUV, ISO, CE
• Dimension: Customized
• Purity: 99.5%
• Application: PVD Coating
• Chemical Composition: 99.5% Aln
• MOQ: 1 PC
• Packing: Vacuum Sealed
• Certificated: ISO 9001, 14001
• Delivery: 7-15 Days
• Surface: Smooth
• Material: Aluminum Nitride
• Transport Package: Vacuum Sealed Package
• Specification: customized
• Trademark: XINKANG
• Origin: Changsha, China
• HS Code: 8486909900
• Production Capacity: 5000pieces/Year

Product Description

Product Name: High-Purity 99.5% Aluminum Nitride Sputtering Target for Thin Film Deposition

Category: Target Material

Keywords: Aluminum nitride sputtering target, High purity aluminum nitride, Thin film deposition material, Semiconductor industry target, AlN sputter target, Ceramic sputtering material, Aluminum nitride coating, PVD coating material, Sputter deposition target, AlN thin film substrate, AlN sputtering target material

Description: Our high-purity 99.5% Aluminum Nitride Sputtering Target is meticulously engineered for the precise demands of thin film deposition in the semiconductor industry. This advanced ceramic sputtering material guarantees unparalleled quality and performance in Physical Vapor Deposition (PVD) coating processes. Boasting an exceptional level of purity, our Aluminum Nitride Sputtering Target delivers outstanding electrical conductivity and thermal stability, making it the perfect choice for sputter deposition applications. The AlN thin film substrate produced through our high-purity target material showcases extraordinary properties, significantly boosting the efficiency and effectiveness of thin film coatings. Rely on our Aluminum Nitride Sputtering Target for consistent, precise, and superior results in all your thin film deposition projects.