• Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
  • Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
  • Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
  • Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
  • Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
  • Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded

Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded

Type: Ceramic Target
Shape: Round
Certification: TUV, ISO, CE
Material: Zinc Sulfide
Purity: 99.95%
Size: Customized
Customization:

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Manufacturer/Factory

Basic Info.

Model NO.
XK-ZnS
MOQ
1 PC
Free Sample
Accept
Application
Glass/Metal/Plastic/Ceramic Coating
Packing
Wooden Case
Certificate
Provide for Each Target
Transport
by Express
Delivery
5-10 Days
Transport Package
Wooden Case
Specification
customized
Trademark
no
Origin
China
HS Code
8486909900
Production Capacity
1000 PCS/Year

Product Description

       

Zinc Sulfide Sputtering Target Features

Chemical Composition: zinc sulfide

Available Purity: 3N5

Production Technology: Powder Metallurgy

Shapes: planar targets

Available size: round target, diameter ≤ 14", rectangle target, according to your requirement

Indium bonding is recommended for this materials

Advantages: uniform color, smooth surface, no cracks, no chipping, no foreign inclusions and contaminants.

Company Profile:

Since 2014

Specializing in high purity sputtering targets.

Leader manufacturer of sputtering materials in China.

Qualified the world certificates such as ISO9001:2008 and SGS.

Comprehensive in R&D, manufacturing, and sales on thin film materials.

Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.

   Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
OUR PRODUCTS     

*Metal Target : W, Mo, Ta, Nb, Cu, V, Ni, Ti, Fe, Al ,Zr, Co, Au, Ag, Pt, etc.

*Alloy Target : NiFe, NiCr, NiV, CuNi,TiAl, CoCr, CoFe, WTi, CoTaZr,CuInGa, ZnSn, CuZn, etc

*Ceramic Target : TiO2,Al2O3,Ta2O5, ZrO2,SiC,SiO,SiO2, ITO, GZO, AZO, WS2, MoS2,Ga2O3,HfO2,etc

*Evaporation Materials : Crucible, Pellets,Granules,Pieces,etc

*Backing Plate: Cu, Mo, SS,etc

*Bonding Service: Indium, Elastomer

      Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded        



  OUR ADVANTAGE

1,Many years manufacturing & exporting experience.

2 Strict & complete QC systerm

3,Perfect after sale systerm
Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
 PRODUCTION PROCESS

Vacuum electron beam furnace, vacuum induction melting furnace, forging machine, rolling mill, oil press,

vacuum annealing furnace, numerical control lathe, numerical control milling machine, machining center, 

grinding machine, wire cutting, numerical control water cutting, XRF, icp-oes, metallographic detector, etc


PACKING & DELIVERY
 
Packaging Detail:
Inside: drying agent and vacuum sealed to prevent oxidization
Outside: wooden case to avoid damage during transportation


 
Delivery Detail: Within 3-15 working days .
DHL, FedEx, UPS door to door service, 5-7 days from China to your country.

 
Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded
OUR CERTIFICATE
Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded Zinc Sulfide Sputtering Target with Copper Backing Plate Bonded

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Contact Supplier

Diamond Member Since 2018

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Manufacturer/Factory
Management System Certification
ISO 9001, ISO 14001