• 99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
  • 99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
  • 99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
  • 99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
  • 99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
  • 99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use

99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use

Type: Metal Target
Shape: Plate
Certification: TUV, ISO, CE
Purity: 99.9%-99.9999%
Size: D50.8X3mm or as Your Request
OEM: Support
Customization:
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Overview

Basic Info.

Model NO.
XK-Cu
MOQ
1PCS
Materials
Pure Metal Copper
Application
PVD Film Coating
Delivery Time
7-21days
Transport Package
Vacuum Blister
Specification
Copper Target
Trademark
XinKang
Origin
China
HS Code
7402000090
Production Capacity
10000PCS/Month

Product Description

99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
Product Description

XinKang Factory Supply Top Ranking 4N 99.99% High Purity Cuprum/Cu/Copper Planar Target for PVD Coating and Evaporation Materials Copper Target
Name Metal Copper Sputtering Target (Cu Target)
Material Copper Metal Materials
Purity 99.9%-99.995%, 3N,3N5,4N,4N5,5N,5N5,6N,
Size D50.8x3mm, 2inch,3inch,Or As Request
Color Metallic Color
Shape Planar/Round/Plate/Rotary/Bar , As Request.
Surface Polished Surface
Density 8.954g/cm3
Melting Point 1083°C
Application PVD Film Coating,Optical Thin Film Coating,Industry Usage,Process,Semidoductor area,Experiments etc
Related Item Al,Mg,Cu,Ni,Co,Fe,Zn,Sn,Bi,Ga,Ge,In,V,W,Mo,Nb,Ta,Cr,Zr,Ti,Hf etc + Metal Alloy sputtering targets+Ceramic targets
Note Support customize size,shape,purity,different alloy proportion etc.
Contact us firstly (Price is based on size and purity)

Description:

Our Copper sputtering targets boast the same outstanding properties as pure metal copper (Cu). Copper, denoted by the chemical symbol Cu (from the Latin cuprum), holds atomic number 29. As a soft, malleable, and ductile metal, it exhibits exceptional thermal and electrical conductivity. Freshly exposed pure copper gleams with a pinkish-orange hue. This versatile metal finds extensive use as a conductor of heat and electricity, a vital building material, and a crucial component in various metal alloys. Copper Sputtering Targets, crafted through advanced melting technology, are extensively employed in the semiconductor, decorative coating, and advanced packaging sectors.

We specialize in producing copper sputtering targets with purities ranging from 99.9% to an astounding 99.9999%, achieving oxygen contents as low as <1ppm. These targets are primarily utilized in display screens, touch screen wiring, protective films, solar light absorbing layers, and semiconductor wiring. Our production capabilities extend to both planar copper sputtering targets (up to maximum G8.5 generation) and copper rotary targets, predominantly serving the touch screen industry. By mastering techniques to prevent grain breakage and employing significant deformation processes, we control twin growth to attain a fine, uniform microstructure. This ensures a lower erosion rate and reduces particle formation sensitivity during sputtering, delivering superior performance.
Product Parameters

99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
Application:
Preparation Process of Copper Sputtering Target
Material Preparation - Electrolytic Purification & Electron Beam Melting - Chemical Analysis - Forging - Rolling - Annealing - Metallographic Inspection - Machining - Dimensional Inspection - Cleaning - Final Inspection - Packaging

Copper Sputtering Target and Its Preparation Method
The copper undergoes purification, elevating its purity levels from 99.95% to 99.99%, 99.999%, and even reaching the pinnacle of 99.9999% (6N) through sophisticated processes like multiple electrolysis and regional smelting. Achieving China's highest purity of 99.9999%, this copper is transformed using high-purity copper ingots as the base material. The stages of forging, rolling, and heat treatment refine and densify the crystal grains within the copper ingots, ensuring they meet the stringent standards required for copper sputtering targets. Post-deformation, the high-purity copper undergoes meticulous mechanical processing to achieve the precise dimensions and superior surface quality demanded by vacuum coating machines.

Other Alloy Forms of Copper Sputtering Target
Diverse Range of Alloy Targets: Tin-Copper, ***-Copper, Tungsten-Copper, Silver-Copper, Copper-Phosphorus, Nickel-Copper Alloy Targets, and more.

Related Products:
99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
Ceramic Targets
Oxide AI203, ZnO, ITO, MoO3, WO3, NiO, CeO2, In203, Ga203, etc.
Sulfide CuS, SnS, ZnS, WS2, MoS2, FeS, Sb2S3, etc.
Nitride AIN, TIN, Si3N4, NbN, TaN, BN, etc.
Carbide B4C, SiC, WC, TIC, TaC, etc.
Fluoride YbF3, MgF2, CaF2, LiF, AIF3, etc.
Others LaB6, MgB2, Sb2Te3, etc.
   
Alloy Tagets
Nickel Based NiV, NiFe, NiTi, NiCo, NiAl, NiCu, NiCrSi, NiCuTi, NiCuMn, NiCrCo, NiCoFeTi,etc
Iron Based FeCo, FeNi, FeCoTaZr, FeMn, FeSi, FeCr, FeHf,etc
Cobalt Based CoTaZr,CoCr, CoCu, CoCrW, CoCrMo.CoCrNiMo.etc
Copper Based CuGa, CuNi, CuAl, CuTi, CulnGa, CuNiTi, SnAgCu,etc
Aluminum Based AlTi, AlCr, AlCrSi, AlCu, AlSi, AlSiCu, AlSnCu, etc
Other Alloy WTi, ZnAl, ZnSn
   
Metal Targets
High purity metal Ni, Ti, Co, Cu, Fe, Al, Sn, Zn, Mg, In, Ge, Si, Bi, Zn, V, etc ;
Rare earth metal Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu,etc
Refractory metal Hf, Zr, Ta, Nb, w, Mo,etc
Precious metal Ir, Ru, Pd, Os, etc

99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
Company Profile

Factory:
Founded in 2014, Changsha XinKang Advanced Materials Co., Ltd is a professional factory specialized in the research, development, production, processing, sales and service of metal materials.Including: Metal elements, Alloy,metal sputtering targets, alloy targets,ceramic targets,evaporation materials, Metal powder,alloy powder,and other customized metal items. We process our products according to the standards of GB/T, ASTM/B ASME SB, AMS, DIN, JIS and other requirements from customers. And these products have been widely used in the petrochemical industry, aerospace and aviation, shipbuilding, energy, medical, military, electronics, environmental protection, machinery and instruments, metallurgy, automotive and other fields. Our factory is located in Changsha, Hunan, which covers an area of 4000 square meters. It has been certificated with ISO9001:2015 quality management system and ISO14001:2015 environmental management system. At present, the company is well equipped with Hi-tech equipment and a huge contingent of technicians. To ensure the excellent quality, we test the products with carbon sulfur instrument, spectrometer, flaw detector, cupping machine, stiffness tester and so on. Professional technician, skilled workers and advanced equipment enable us to present products and services with high quality. Our products have been exported to USA, Europe, Middle East, Japan, Korea, Singapore, India and Kenya, it's good quality, competitive price, timely delivery and best after-sales service are highly appreciated by our customers.
99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
Certifications

99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
Factory and Equippments

99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
Packaging & Shipping

99.9%-99.9999% Purity Copper Back Plate C10100 C11000 C12200 for Industrial Use
FAQ

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