Thin film coating materials CuNi sputtering target Product: | CuNi sputtering target |
Purity: | 99.9%-99.95% |
Size: | customized |
Shape: | Planar and rotary |
Technology: | Vacuum Melting |
Application: | infrared detectors and magnetic data storage field,etc |
Packing: | Vacumm sealed, wooden case |
Copper Nickel Sputtering Target is produced by melting technology, it's usually used for depositing electromagnetic interference (EMI) shielding layer, for the field of electronic products such as smartphone, PAD, and etc. With up to 3N5 purity, uniform grain size, lower oxygen content, end user can obtain constant erosion rates as well as high purity and homogeneous thin film coating during PVD process.
PRODUCTION PROCESS