High Density Copper Back Plate 99.999% Pure for Industrial Applications

Product Details
Customization: Available
Type: Metal Target
Shape: Round

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  • High Density Copper Back Plate 99.999% Pure for Industrial Applications
  • High Density Copper Back Plate 99.999% Pure for Industrial Applications
  • High Density Copper Back Plate 99.999% Pure for Industrial Applications
  • High Density Copper Back Plate 99.999% Pure for Industrial Applications
  • High Density Copper Back Plate 99.999% Pure for Industrial Applications
  • High Density Copper Back Plate 99.999% Pure for Industrial Applications
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  • Overview
  • Product Description
  • Product Parameters
  • Company Profile
  • Certifications
  • Factory and Equippments
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
XK-Cu
Purity
99.9%-99.9999%
Size
D50.8X3mm or as Your Request
OEM
Support
MOQ
1PCS
Materials
Pure Metal Copper
Application
PVD Film Coating
Delivery Time
7-21days
Transport Package
Vacuum Blister
Specification
Copper Crucible
Trademark
XinKang
Origin
China
HS Code
7402000090
Production Capacity
10000PCS/Month

Product Description

High Density Copper Back Plate 99.999% Pure for Industrial Applications
Product Description

XinKang Factory Supply Top Ranking Wholesales 99.95% Purity Cu Copper Crucible Copper Melting Crucible for Induction Furnace for Evaporation Materials Copper Target
Name Metal Copper Crucible (Cu Crucible)
Material Copper Metal Materials
Purity 99.9%-99.995%, 3N,3N5,4N,4N5,5N,5N5,6N,
Size D50.8x3mm, 2inch,3inch,Or As Request
Color Metallic Color
Shape Planar/Round/Plate/Rotary/Bar , As Request.
Surface Polished Surface
Density 8.954g/cm3
Melting Point 1083°C
Application PVD Film Coating,Optical Thin Film Coating,Industry Usage,Process,Semidoductor area,Experiments etc
Related Item Al,Mg,Cu,Ni,Co,Fe,Zn,Sn,Bi,Ga,Ge,In,V,W,Mo,Nb,Ta,Cr,Zr,Ti,Hf etc + Metal Alloy sputtering targets+Ceramic targets
Note Support customize size,shape,purity,different alloy proportion etc.
Contact us firstly (Price is based on size and purity)

Description:

Our Copper Sputtering Targets possess identical properties to pure metallic copper (Cu). Recognized by its symbol Cu, derived from the Latin 'cuprum', copper holds an atomic number of 29. This versatile element is renowned for its softness, malleability, and ductility, combined with exceptional thermal and electrical conductivity. Newly exposed pure copper exhibits a distinctive pinkish-orange hue. Copper's applications span across heat and electricity conduction, structural material roles, and alloy compositions. Our Copper Sputtering Targets, crafted via advanced melting technology, find extensive use in semiconductors, decorative coatings, and cutting-edge packaging industries.

Our expertise enables us to produce Copper Sputtering Targets with purity levels ranging from 99.9% to an astounding 99.9999%, maintaining an oxygen content as low as <1ppm. These targets are predominantly utilized in display and touch screen wiring, protective films, solar light-absorbing layers, and semiconductor wiring. We manufacture both planar copper sputtering targets (up to G8.5 generation) and copper rotary targets, primarily catered to the touch screen industry. Overcoming the challenges of grain breaking, we employ significant deformation processing and twin growth control to achieve a refined and uniform microstructure. This ensures a reduced erosion rate and minimizes particle formation sensitivity during sputtering.
Product Parameters

High Density Copper Back Plate 99.999% Pure for Industrial Applications
Application:
Preparation Process of Copper Sputtering Target
Material Preparation: Electrolytic Purification & Electron Beam Melting → Chemical Analysis → Forging → Rolling → Annealing → Metallographic Inspection → Machining → Dimensional Inspection → Cleaning → Final Inspection → Packaging

Copper Sputtering Target and Preparation Method Thereof
Our copper undergoes meticulous purification processes, elevating its purity from 99.95% to industry-leading levels of 99.99%, 99.999%, and an exceptional 99.9999% (6N) purity, the highest in China. Using high-purity copper ingots, further refinement through forging, rolling, and heat treatment results in smaller crystal grains and increased density, meeting the stringent requirements of sputtering copper targets. The post-deformation high-purity copper is then precisely machined to achieve the high precision and surface quality demanded for vacuum coating machine targets.

Diverse Alloy Forms of Copper Sputtering Targets
We offer a variety of copper alloy targets, including Tin-Copper, ***-Copper, Tungsten-Copper, Silver-Copper, Copper-Phosphorus, and Nickel-Copper alloy targets, among others.

Related Products:
High Density Copper Back Plate 99.999% Pure for Industrial ApplicationsHigh Density Copper Back Plate 99.999% Pure for Industrial Applications
Ceramic Targets
Oxide AI203, ZnO, ITO, MoO3, WO3, NiO, CeO2, In203, Ga203, etc.
Sulfide CuS, SnS, ZnS, WS2, MoS2, FeS, Sb2S3, etc.
Nitride AIN, TIN, Si3N4, NbN, TaN, BN, etc.
Carbide B4C, SiC, WC, TIC, TaC, etc.
Fluoride YbF3, MgF2, CaF2, LiF, AIF3, etc.
Others LaB6, MgB2, Sb2Te3, etc.
   
Alloy Tagets
Nickel Based NiV, NiFe, NiTi, NiCo, NiAl, NiCu, NiCrSi, NiCuTi, NiCuMn, NiCrCo, NiCoFeTi,etc
Iron Based FeCo, FeNi, FeCoTaZr, FeMn, FeSi, FeCr, FeHf,etc
Cobalt Based CoTaZr,CoCr, CoCu, CoCrW, CoCrMo.CoCrNiMo.etc
Copper Based CuGa, CuNi, CuAl, CuTi, CulnGa, CuNiTi, SnAgCu,etc
Aluminum Based AlTi, AlCr, AlCrSi, AlCu, AlSi, AlSiCu, AlSnCu, etc
Other Alloy WTi, ZnAl, ZnSn
   
Metal Targets
High purity metal Ni, Ti, Co, Cu, Fe, Al, Sn, Zn, Mg, In, Ge, Si, Bi, Zn, V, etc ;
Rare earth metal Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu,etc
Refractory metal Hf, Zr, Ta, Nb, w, Mo,etc
Precious metal Ir, Ru, Pd, Os, etc

High Density Copper Back Plate 99.999% Pure for Industrial ApplicationsHigh Density Copper Back Plate 99.999% Pure for Industrial ApplicationsHigh Density Copper Back Plate 99.999% Pure for Industrial Applications
Company Profile

Factory:
Founded in 2014, Changsha Xinkang Advanced Materials Co., Ltd. stands as a beacon of excellence in the research, development, production, processing, sales, and service of high-quality metal materials. Our extensive product range includes Metal Elements, Alloys, Metal Sputtering Targets, Alloy Targets, Ceramic Targets, Evaporation Materials, Metal Powders, Alloy Powders, and other customized metal items. We meticulously adhere to the standards of GB/T, ASTM/B ASME SB, AMS, DIN, JIS, and specific customer requirements. These premium products find applications across a myriad of industries such as Petrochemical, Aerospace, Aviation, Shipbuilding, Energy, Medical, Military, Electronics, Environmental Protection, Machinery, Instruments, Metallurgy, and Automotive. Located in Changsha, Hunan, our state-of-the-art factory spans 4000 square meters and is certified with ISO9001:2015 Quality Management and ISO14001:2015 Environmental Management systems. Equipped with cutting-edge technology and a robust team of skilled technicians, we ensure excellence through rigorous testing using carbon sulfur instruments, spectrometers, flaw detectors, cupping machines, stiffness testers, and more. Our commitment to high-quality products and services has earned us a loyal clientele across the USA, Europe, Middle East, Japan, Korea, Singapore, India, and Kenya. We pride ourselves on competitive pricing, timely delivery, and exceptional after-sales service, making us a trusted partner in the global market.
High Density Copper Back Plate 99.999% Pure for Industrial Applications
Certifications

High Density Copper Back Plate 99.999% Pure for Industrial Applications
Factory and Equippments

High Density Copper Back Plate 99.999% Pure for Industrial Applications
Packaging & Shipping

High Density Copper Back Plate 99.999% Pure for Industrial Applications
FAQ

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