Chemical Composition: pure Al Available Purity: 2N5, 3N, 4N, 5N, 5N5 Production Technology: melting Shapes: planar targets, rotary targets Average Grain Size: < 300um, structure of fine grains can be customized
Application of Aluminum Sputtering Targets
Aluminum Sputtering Targets are produced by melting technology, usually apply foroptical coating and semiconductor field. With up to 5N purity, uniform grain size, lower oxygen content, end user canobtain constant erosion rates as well as high purity and homogeneous thin film coating during PVD process.
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