Manufacturer Silicon Aluminum Alloy Sial Sputtering Target

• Type: Alloy Target
• Certification: TUV, ISO, CE
• Purity: 99.95%-99.99%
• Size: Customized
• MOQ: 1 PC
• Free Sample: Accept
• Model NO.: XK-SiAl
• Packing: Wooden Case
• Certificate: Provide for Each Target
• Transport: by Air
• Delivery: 5-10 Days
• HS Code: 8486909900
• Production Capacity: 1000 PCS/Year

Product Description

 

      Aluminum Silicon Sputtering Targets are produced by melting technology, usually used for IC application. By adding small amount of silicon and copper metals, aluminium interconnects' electromigration and diffusion to wafer can be improved effectively, and service life can be raised greatly. Aluminum Silicon Copper AlSiCu 98.5/1/0.5wt% Sputtering Targets are adopted for ULVAC, ANEALVA and Varian sputtering machines. With up to 4N purity, uniform grain size, lower oxygen content, end user can obtain constant erosion rates as well as high purity and homogeneous thin film coating during PVD process.

 

Features

Chemical Composition: AlSi 99/1wt%, AlSiCu 98.5/1/0.5wt%, AlSi 90/10wt%, AlSi75/25wt%, AlSi50/50wt%, AlSi25/75wt%, other composition can be customized

Segregation of weight: +/-0.2wt%

Available Purity: 3N, 4N

Production Technology: melting

Shapes: planar targets

Average Grain Size: < 300um, structure of fine grains can be customized   

 

                                    
                                                          PRODUCTION PROCESS