• Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
  • Ofhc Copper Backing Plate for Sputtering Target Indium Bonding

Ofhc Copper Backing Plate for Sputtering Target Indium Bonding

Type: Metal Target
Shape: Round
Certification: TUV, ISO, CE
Purity: 99.95%-99.999%
Material: Nickel
Size: Customized
Customization:
Diamond Member Since 2018

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Manufacturer/Factory

Basic Info.

Model NO.
XK-Cu
Application
Bonding
MOQ
1 PC
Free Sample
Accept
Packing
Wooden Case
Certificate
Provide for Each Target
Transport
by Express
Delivery
5-10 Days
Transport Package
Wooden Case
Specification
any size
Trademark
no
Origin
China
HS Code
8486909900
Production Capacity
1000 PCS/Year

Product Description

Copper/Cu sputtering target features:

Chemical Composition: pure Cu

Available Purity: 3N5-5N

Production Technology: EB melting

Shapes: planar targets, rotary targets

Average Grain Size: < 100um  


Copper Sputtering Targets are produced by melting technology, it's widely applied for semiconductor, decorative coating and advanced packing field. With up to 5N purity, uniform grain size, lower gas content, end user can obtain constant erosion rates as well as high purity and homogeneous thin film coating during PVD process. We also produce pure copper C10200, and oxygen free copper C10100 backing plates for customers, the biggest length is up to 1600mm.
Ofhc Copper Backing Plate for Sputtering Target Indium BondingOfhc Copper Backing Plate for Sputtering Target Indium Bonding
 

Company Profile:

Since 2014

Specializing in high purity sputtering targets.

Leader manufacturer of sputtering materials in China.

Qualified the world certificates such as ISO9001:2008 and SGS.

Comprehensive in R&D, manufacturing, and sales on thin film materials.

Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.
Ofhc Copper Backing Plate for Sputtering Target Indium BondingOfhc Copper Backing Plate for Sputtering Target Indium Bonding

OUR PRODUCTS     

*Metal Target : W, Mo, Ta, Nb, Cu, V, Ni, Ti, Fe, Al ,Zr, Co, Au, Ag, Pt, etc.

*Alloy Target : NiFe, NiCr, NiV, CuNi,TiAl, CoCr, CoFe, WTi, CoTaZr,CuInGa, ZnSn, CuZn, etc

*Ceramic Target : TiO2,Al2O3,Ta2O5, ZrO2,SiC,SiO,SiO2, ITO, GZO, AZO, WS2, MoS2,Ga2O3,HfO2,etc

*Evaporation Materials : Crucible, Pellets,Granules,Pieces,etc

*Backing Plate: Cu, Mo, SS,etc

*Bonding Service: Indium, Elastomer       
                                      
 OUR ADVANTAGE


1,Many years manufacturing & exporting experience.

2 Strict & complete QC systerm

3,Perfect after sale systerm                                                   
Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
 
PACKING & DELIVERY
 
Packaging Detail:
Inside: drying agent and vacuum sealed to prevent oxidization
Outside: wooden case to avoid damage during transportation

 
Delivery Detail: Within 3-15 working days .
DHL, FedEx, UPS door to door service, 5-7 days from China to your country.
 
Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
OUR CERTIFICATE
Ofhc Copper Backing Plate for Sputtering Target Indium Bonding
Ofhc Copper Backing Plate for Sputtering Target Indium Bonding


 

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Diamond Member Since 2018

Suppliers with verified business licenses

Manufacturer/Factory
Management System Certification
ISO 9001, ISO 14001