Semiconductor Grade Aluminum Nitride PVD Target

• Type: Ceramic Target
• Shape: Round
• Certification: TUV, ISO, CE
• Dimension: Customized
• Purity: 99.5%
• Application: PVD Coating
• Chemical Composition: 99.5% Aln
• MOQ: 1 PC
• Packing: Vacuum Sealed
• Certificated: ISO 9001, 14001
• Delivery: 7-15 Days
• Surface: Smooth
• Material: Aluminum Nitride
• Transport Package: Vacuum Sealed Package
• Specification: customized
• Trademark: XINKANG
• Origin: Changsha, China
• HS Code: 8486909900
• Production Capacity: 5000pieces/Year

Product Description

Product Name: High-Purity 99.5% Aluminum Nitride Sputtering Target for Thin Film Deposition

Category: Target Material

Keywords: Aluminum nitride sputtering target, High purity aluminum nitride, Thin film deposition material, Semiconductor industry target, AlN sputter target, Ceramic sputtering material, Aluminum nitride coating, PVD coating material, Sputter deposition target, AlN thin film substrate, AlN sputtering target material

Description: Our premium 99.5% high-purity aluminum nitride sputtering target is meticulously engineered for thin film deposition within the semiconductor industry. This outstanding ceramic sputtering material guarantees superior quality and unparalleled performance in PVD coating processes. Boasting an exceptional purity level, our aluminum nitride sputtering target ensures superb conductivity and remarkable thermal stability, making it the top choice for all sputter deposition applications. The AlN thin film substrate fabricated using our sputtering target material demonstrates extraordinary properties, significantly enhancing the efficiency and effectiveness of thin film coatings. Rely on our aluminum nitride sputtering target to deliver consistent, precise results for all your thin film deposition needs.