Hot-Sale Niv7 Target Niv7wt% Metal Nickel Vanadium Rotary Sputtering Target for PVD Process

• Warranty: Within 30 Days After Shipment
• Condition: New
• Certification: ISO9001
• Customized: Customized
• Material: Nickel Vanadium Metal Alloy
• Application: Metallurgy, Industry,Experiments,DIY.
• Model NO.: XK-NiV
• Usage: PVD Film Coating
• Shape: Rotary,Plate,Circle,Pellets
• Delivery Time: 7-21days
• Keywords: Metal Nickel Chromium Alloy
• Percent: Niv7wt%
• Size: D50.8X3mm or as Request
• Purity: 99.9%-99.99%
• Chemical Composition: Niv7wt%
• Appearance: Polished Surface
• MOQ: 1PC
• Product Name: Nickel Vanadium Alloy Rotary Target
• Package: Vacuum Blister
• Transport Package: Vacuum Sealed Package Inside
• Trademark: XinKang
• Origin: Hunan, China
• Production Capacity: 1000000 Piece/Pieces Per Month

Product Description

Product Description

 

XinKang Hot Sale NiV7 Target NiV7wt% Metal Nickel Vanadium Rotary Sputtering Target for PVD Process

Name	Metal Nickel Vanadium Alloy Sputtering Targets
Purity	99.9%-99.99%
Size	D50.8x3mm, D76.2x6mm,2inch,3inch, As request
Ni Boiling Point	2732
Ni Density	8.9g/cm³
Ni Melting Point	1453.0
Shape	Planar target, Rotary target.
MOQ	1PCS
Application	Evaporation materials, PVD Film Coating and etc

Preparation process of nickel-vanadium alloy sputtering target

 

Material Preparation - Vacuum Induction Melting - Chemical Analysis - Forging - Rolling - Annealing - Metallographic Inspection - Machining - Dimensional Inspection - Cleaning - Final Inspection - Packaging

 

In the fabrication of integrated circuits, pure gold is generally used as interconnect metal, deposited on a silicon wafer, but gold will diffuse into the silicon wafer to form a high-resistance AuSi compound, which will greatly reduce the current density in the wiring, resulting in the failure of entire wiring system.

 

So, It is proposed to add adhesive layer between the gold thin film and silicon wafers. The adhesive layer is usually made of pure nickel, but diffusion also occurs between the nickel layer and the gold conductive layer, so that a barrier layer is needed to prevent diffusion between the gold conductive layer and nickel adhesive layer.

 

With a high melting point and a large current density, vanadium is chosen to deposit barrier layer, therefore, nickel sputtering target, vanadium sputtering target, gold sputtering target are all used in the fabrication of integrated circuits.

Nickel vanadium NiV sputtering targets containing 7% vanadium has both advantages of nickel and vanadium, thus adhesive layer and barrier layer can be achieved at a time. NiV alloy is non-magnetic materials, which is conducive to magnetron sputtering. In the electronics information industry, it is gradually replacing pure nickel sputtering targets.

The picture below are two micrographs of our NiV(93/7 wt%) alloy sputtering target, the average grain size<100μm.

Following is a typically Certificate of analysis for 3N5 NiV 97/3wt% sputtering target. 

 

 

 

Other Related Sputtering Targets

Metal Target	Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and rare earth targets
Alloy Target	Ni,Fe,Co,Cu,Al alloy. and special alloy
Evaporation Materials	Ni,Al,Cu,V,Co,W,Mo,Ta,Nb,Cr,Ti,Zr,Hf,Mg,Fe,Zn,Pb,Sn,Bi,Ga,Ge,In,Si,C,B,Te and etc
Ceramic Targets	Oxide Ceramic, Compound ceramic targets.

 

Company Information

 

 

 

1. Are you trading company or manufacturer ?
Xinkang: We are a professional manufacturer specialized in this field for over 10 years.

 

2: How long is your delivery time?
Xinkang: Shipment can be made in 5-7 days for those regular size, or samples , and 15-20 days for batch quantity. 
 
3: Do you have MOQ ? 
Xinkang: No, we support samples.

 

4: What is your payment method?
Xinkang: T/T in advance, Paypal , Western Union and etc.