High-Purity 99.5% Aluminum Nitride Sputtering Target for Thin Film Deposition

• Type: Ceramic Target
• Shape: Round
• Certification: TUV, ISO, CE
• Dimension: Customized
• Purity: 99.5%
• Application: PVD Coating
• Chemical Composition: 99.5% Aln
• MOQ: 1 PC
• Packing: Vacuum Sealed
• Certificated: ISO 9001, 14001
• Delivery: 7-15 Days
• Surface: Smooth
• Material: Aluminum Nitride
• Transport Package: Vacuum Sealed Package
• Specification: customized
• Trademark: XINKANG
• Origin: Changsha, China
• HS Code: 8486909900
• Production Capacity: 5000pieces/Year

Product Description

Product Name: High-Purity 99.5% Aluminum Nitride Sputtering Target for Thin Film Deposition

 

Category: Target Material

 

Keywords: Aluminum nitride sputtering target, High purity aluminum nitride, Thin film deposition material, Semiconductor industry target, AlN sputter target, Ceramic sputtering material, Aluminum nitride coating, PVD coating material, Sputter deposition target, AlN thin film substrate, AlN sputtering target material

 

Description: Our high-purity 99.5% aluminum nitride sputtering target is specifically designed for thin film deposition in the semiconductor industry. This ceramic sputtering material ensures superior quality and performance in PVD coating processes. With a high level of purity, our aluminum nitride sputtering target provides excellent conductivity and thermal stability, making it ideal for sputter deposition applications. The AlN thin film substrate produced using our sputtering target material exhibits exceptional properties, enhancing the overall efficiency of thin film coatings. Trust in our aluminum nitride sputtering target for reliable and precise results in your thin film deposition projects.