99.5% Pure Aln Thin Film Deposition Material

• Type: Ceramic Target
• Shape: Round
• Certification: TUV, ISO, CE
• Dimension: Customized
• Purity: 99.5%
• Application: PVD Coating
• Chemical Composition: 99.5% Aln
• MOQ: 1 PC
• Packing: Vacuum Sealed
• Certificated: ISO 9001, 14001
• Delivery: 7-15 Days
• Surface: Smooth
• Material: Aluminum Nitride
• Transport Package: Vacuum Sealed Package
• Specification: customized
• Trademark: XINKANG
• Origin: Changsha, China
• HS Code: 8486909900
• Production Capacity: 5000pieces/Year

Product Description

Product Name: High-Purity 99.5% Aluminum Nitride Sputtering Target for Thin Film Deposition

Category: Target Material

Keywords: Aluminum nitride sputtering target, High purity aluminum nitride, Thin film deposition material, Semiconductor industry target, AlN sputter target, Ceramic sputtering material, Aluminum nitride coating, PVD coating material, Sputter deposition target, AlN thin film substrate, AlN sputtering target material

Description: Our high-purity 99.5% aluminum nitride sputtering target is meticulously crafted for the demands of thin film deposition in the semiconductor industry. This premium ceramic sputtering material guarantees unparalleled quality and performance in PVD coating processes. Featuring an impressive purity level, our aluminum nitride sputtering target offers outstanding conductivity and thermal stability, making it the perfect choice for precise sputter deposition applications. The AlN thin film substrate produced with our target material boasts exceptional characteristics, significantly improving the efficiency of thin film coatings. Rely on our aluminum nitride sputtering target for consistent, high-precision results in your thin film deposition endeavors.