99.999% Sputter/Sputtering Target Poly Crystal Silicon for Sputtering Machine

• Customization: Available
• Type: Silicon Target
• Shape: Round
• Model NO.: XK-Si
• Certification: TUV, ISO, CE
• Purity: 99.999%
• Size: Customized
• MOQ: 1 PC
• Free Sample: Accept
• Packing: Wooden Case
• Certificate: Provide for Each Target
• Transport: by Air
• Delivery: 5-10 Days
• Material: Silicon
• Transport Package: Vacuum Sealed
• Specification: customized
• Trademark: no
• Origin: China
• HS Code: 8486909900
• Production Capacity: 1000 PCS/Year

Product Description

                  Thin film coating materials silicon/Si sputtering target 
 

Silicon/Si Sputtering Target

Silicon sputtering  target, as a very important functional materials, it mainly used for depositing SiO2, Si3N4 and other deelectric layer by magnetic sputtering process. Those thin films are characterized by excellent hardness, optic, dielectric properties, wear and corrosion resistance, which are widely applied to the field of  LCD transparent conducting glass, LOW-E building  glass and micro-electronics.

Features

Type: poly-crystalline or mono-crystalline

Purity: 5N, 6N

Available shape: Planar, Rotary

Growth method: Czochralski (CZ)

Density:2.33g/cm3

Conductivity type: P type (Boron doped) & N type (phosphorus doped)

Dimension:

length:300mm max

width:150mm max

diameter:300mm max

thickness:3-12mm

tolerance:±0.1mm

Specific resistance:0.005-0.02 ohm.cm

                              1-10 ohm.cm

                              10 ohm.cm min 

Planeness (TIR): < 1.2μm

Partial planeness (STIR): <0.3μm

Warp: <30μm